SortMax+™ Sorter
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- Highly configurable, modular design, allowing integration into specific customer layouts
- Fast and precise handler with minimal vibration X-axis robot translation
- Capable of handling 150 mm, 200 mm and 300 mm wafers in mixed operation
- Fully compliant with SEMI standards and fab requirements
- SECS/GEM integration
- Minimized setup time via automated teaching
- Camera integration for remote monitoring
The SortMax+ Sorter is a new-generation wafer sorter that delivers the highest throughput, while utilizing clean technology, rapid software setup and the lowest cost of ownership. The sorter is designed to operate as standalone equipment and features up to four BOLTS interfaces, a GREX4HT robot on a track, a prealigner, a beam aligner, a buffer station, a flipping station, a wafer ID reader (WID), a controller, a computer, a user interface, an operator station breakout panel and a facility panel.
The wafer sorter is capable of handling 150 mm, 200 mm and 300 mm wafers in mixed operation, or 300 mm wafers exclusively. Switching between handling 150 mm/200 mm wafers and 300 mm wafers can be performed quickly and reliably by replacing a minimal number of components, without requiring any design changes to the sorter’s main components.
The system is composed of a set of tightly coupled, hierarchical, intelligent subsystems, each performing specific functions under the supervision of a main computer running the GIFT platform. In addition to database management, wafer import/export, and recipe creation/editing, the system provides functions such as wafer mapping, wafer ID reading and alignment. To ensure safe and reliable operation, all subsystems have been individually certified to meet relevant industry performance and safety standards. A safety monitoring protocol is incorporated into the control structure, ensuring that each atomic procedure is confirmed before the next command is issued.
- Optimized for a minimal footprint
- Available with various robot arms and end effector options, enabling the sorting of a wide variety of substrates
- Capable of sorting thin and bowed substrates
- Flexible substrate ID reading (top and bottom)
- Optional UI and light tower configuration and placement
- Optional substrate flipping capability
- Wafer edge inspection, defect detection and diameter measurement
- Remote connectivity, advanced data logging and diagnostics
- On-the-fly beam centering capability significantly reduces alignment time, thereby increasing overall throughput
| General Specification | |
|---|---|
| Loading modules handled | -300mm FOUP -200mm OC installed on an OC adapter |
| Throughput | > 350 WPH with wafer ID reading and aligning |
| Reliability | -MTBF = 15,370 hours -MCBF 2 = 459; 200 hours -Uptime: 95% |
| Altitude | Up to 1000m above sea level |
| Ambient air temperature | +5° to +40° C |
| Earthquake protection | Floor anchor brackets, optional |
| Particle contamination | <= 0.0016 adders per cm² per wafer pass, i.e. not more than 5 adders after 10 cycles of one 200mm diameter wafer, for particles of over 0.2 µm size |
| Operating system | Linux |
| Basic operation modes | -Transfer -Split -Merge -Compress -Randomize -Wafer ID Map -Alignment -Sorting -Template-Based Sorting -Visual Inspection -Defect-Based Sorting |
| Power Specification | |
| Main power voltages | Circuit A (Main Power): 110-230 AC Volts 50/60Hz; Single Phase; Max Load 30 Amps; AIC 18K Amps Circuit B (Linear Track): 200-240 AC Volts 50/60Hz; 3 Phase Delta; Max Load 30 Amps; AIC 25K Amps Air Handler (FFU): Power input is fixed at 220V |
| Current protection circuits | 208V 3 Phase protection 230V Single phase power |
| Main power disconnect switch | Pistol grip handle at top of power box |
| Peak starting currents (when the unit is turned on, all three circuits are idle) | Circuit A: Start 1 = 7.0A, Start 2 = 8.9A, Start 3 = 8.0 Circuit B: Start 1 = 8.5A, Start 2 = 8.3A, Start 3 = 9.0 |
| FACILITY REQUIREMENTS | |
| Vacuum requirements | No less than 0.1 CFM air flow, at -40kPa (-5.8 psi) |
| Pressure requirements | 85-100 psi. |
| Exhaust | Exhaust connection from EFEM optional, depending on the interfaced equipment. When required, all exhaust connections are to be connected to FAB exhaust. |
| Standards to Verify Compliance | |
| SEMI | • SEMI S2-0302 – Safety Guidelines (third-party audit: S2-0200) • SEMI S8-0701 – Ergonomics and Human Factors (S8-0600 for the Mini-Environment System; S8-0701 for the Porta300) • SEMI S14-0200E – Fire Risk Assessment (part of S2-0200) • SEMI F42-0600 & SEMI F47-0200 – Voltage Sag Immunity • EC Directives – Machinery Directive 89/392/EEC, Electromagnetic Compatibility Directive 89/336/EEC, and Low Voltage Directive 73/23/EEC • CE Mark achieved • NFPA 70 – National Electrical Code Handbook • NFPA 79 – Electrical Standards for Industrial Equipment (part of S2-0200) • ISO 14644-1 – 1st Edition, Air Cleanliness Classification • Compliant with 10° off-axis tip test: the unit’s center of mass ensures that a tilt of 10° or less will not cause it to topple |
| Other Standards | CE Standards, International Sematech Integrated Minienvironment Best Design Practice |
| Environment | |
| Cleanliness | Class 1 |
Material Handling Robot
The material handling robot integrated into the sorter is a dual-arm Grex4 robot mounted on a horizontal track. The robot is specifically designed for track-mounted operation. The horizontal track assembly enables single-axis, side-to-side linear motion, while the robot provides vertical travel of 17 inches and three additional axes for end-effector control.
SortMax+ Layout
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