- Serviceability, manufacturability and reliability built into design
- Highest tested reliability components
- Optimized manufacturing assembly: <2hr
- Field repair time of <1hr
The EVTMHS is a wafer handling system with extended vertical travel designed to transport 300mm wafers in semiconductor manufacturing tools that require large work envelope solutions.
The system can also handle 200mm wafers without any hardware changes. For wafer sizes below 200mm, the robot end effector has to be reconfigured – a task that less than an hour, including the time needed to teach all the pickup positions. Thus, the average teaching time of 45 minutes (for pickup locations) can be achieved thanks to the sophisticated autoteach routines provided by the system firmware.
The optional through beam mapping sensor allows for reliable detection of normally inserted, cross-slotted, or double-slotted wafers in FOUPs and boats. Depending on the chosen arm configuration the system can access one or two in-line Semi standard FOUPs. From the operational point of view, the system is fully integrated and controlled by a single controller.
- Beltless transmission design
- Reduced weight and improved stiffness
- Fully coordinated motions
- Advanced motion profiling and blending
- Beam-based wafer centering on-the-fly
- Multiple point boat teaching
- Modular attachment/detachment of mechanical sub-systems.
- Operating temperature range: 20 degrees C to 55 degrees C
- Storage temperature range: 20 degrees C to 60 degrees C.
- Atmosphere: CDA (80% N2) up to 100% Nitrogen. No silicone materials to be used anywhere within the system. No plastics that rely on their hydroscopic properties to provide a lower coefficient of friction (Nylon) are allowed.
- Humidity: 0% to 60% operating, 0% to 95% non-condensing stored.
| Configuration | |
|---|---|
| Substrate Size | up to 300mm |
| Arm Configurations | 7-25"-7.25" |
| End Effector | Vacuum, Edge-Gripping, Gravity |
| Wafer Mapping | Reflective, through-beam, retro reflective (requires installation of reflective tape behind wafer carriers) |
| Physical Properties | |
| Size (length) | 11.7' |
| Axes | 3 – T,R,Z. |
| Range of Motion | T: 500° R: [-14.25", 14.25"] Z: 40.57" |
| Performance | |
| Payload | 2 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0.001" |
| Environment | |
| Cleanliness | ISO Class 1 Compatible |
| Wafer Contact Materials | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC(EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204-1:1997 EN 55011 EN ISO 12100-2:2003 RIA R15.06:1999 |
| Reliability per SEMI E10 | >15M MCBF |
