- Integrated prealigner in a compact package
- Fast, accurate, repeatable transport of wafers and photomasks
- DSP-based motion controller for vibration-free wafer transport
- Multi-segment continuous path control
- Extended reach and vertical travel options
The GB4P Robot System with integral wafer prealigner is the most compact robot and prealigner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput.
Identical in size to Nidec Genmark’s original GB4 robot, the GB4P houses a built-in prealigner for wafers ranging from 2″- 8″ in diameter. The adjustable feature on the prealigner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations.
Nidec Genmark’s GB4P Robot System is a highly accurate, repeatable, and reliable wafer handling and aligning solution for wafer sizes up to 200mm.
- Integrated prealigner module
- Adjustable lighthouse for wafers ranging in 2"-8" in diameter
- Optional scanning feature with fast and slow scanning mode
| Configuration | |
|---|---|
| Substrate Size | up to 200mm |
| Arm Configurations | 5.25"-5.25"; 7.25" -7.25"; 4"-8"-4" |
| End Effector | Vacuum, Edge-Gripping, Gravity |
| Wafer Mapping | Reflective, through-beam, laser scanner, retro reflective, (requires installation of reflective tape behind wafer carriers) |
| Physical Properties | |
| Size (body diameter) | 9.76" |
| Vertical Stroke / Body Height | 7" / 13.5" 8.5" / 14.3" 12" / 17.85" 17" / 23.5" 20" / 26.5" |
| Axes | 5: Robot - T, R, Z Prealigner - V (vertical), P (chuck rotation) |
| Range of Motion | T: 500° R: - 5.25"-5.25": [-10.5", 10.5"] - 7.25"-7.25"; [-14.5", 14.5"] - 4"-8"-4": [-16", 16"] Z: 7"; 8.5"; 12"; 17"; 20" |
| Performance | |
| Payload (Dynamic/Static) | 2 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0.001" |
| Environment | |
| Cleanliness | ISO Class 1 Compatible |
| Wafer Contact Materials | Vespel, Peek, Teflon impregnated anodized AI, Alumina, Stainless Steel |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC(EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204-1 EN 292-1 EN 292-2 |
| Reliability per SEMI E10 | >15M MCBF |
