- Available in two or three link configuration
- GPR ™ Technology
- Alignment free
- Deflection compensation
- Roll and pitch axes
The GPR-GB8-SM is a precise high-performance dual arm robot for automated transport applications of 300mm wafers.
The combination of global linear motion of the two-links arm (R-axis) and rotation (Y-axis) of two swapping arms (A1 and A2 axes) ensure optimal handling of up to 4 in-line FOUPs, and dimensionally equivalent process modules, without the need to mount the robot on linear track component.
The patented GPR technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end-effector deflection compensation during transport of heavier payloads.
Advanced robot motion planning algorithms assures smooth robot motion and fast swapping of wafers at the process positions and wafer carriers.
- Optional Yaw axis
- Optional multiple end effector
- Optional remote integral prealigner
- Optional scanners with fast and slow scanning modes
- Multi-segment continuous path control
- In-line cassette access
| Configuration | |
|---|---|
| Substrate Size | up to 300mm |
| Arm Configurations | OPTION 1: One Global Translation Arm: 11.075"-11.075" Two Swapping Arms: 6.45" - 6.45" OPTION 2: One Global Translation Arm: 5.95”-11.9”-5.95” Two Swapping Arms: 5.45”-5.45” |
| End Effector | Vacuum, Edge-Gripping |
| Wafer Mapping | Reflective, through-beam, laser scanner, retro reflective (requires installation of reflective tape behind wafer carriers) |
| Physical Properties | |
| Size (body diameter) | 14" |
| Vertical Stroke / Body Height | 12.5" / 20.5" |
| Weight | With arm option 1: 173 lbs With arm option 2: 169.4 lbs |
| Axes | 8: T, R, Y, A1, A2, Z, Z1, Z2 |
| Range of Motion | T: 500° Global Translation Arms (R axis): - 2 Link 11.075"-11.075": [- 21", 21"] - 3 Link 8.05”-16.1”-8.05”: [- 30.6", 30.6"] Swapping Arms (A1, A2 axes): - 2 Link 5.45”-5.45”: [- 10.35", 10.35"] - 2 Link 6.45”-6.45”: [-8.0", 12.3"] Z: 12.5" Y: 680° |
| Performance | |
| Payload (Dynamic/Static) | 1.5 lbs per swapping arm |
| Repeatability | T: +/- 0.01° R: +/- 0.001" A1/A2: +/- 0.001" Z: +/- 0.001" Y: +/- 0.005° |
| Environment | |
| Cleanliness | ISO Class 1 Compatible |
| Wafer Contact Materials | Vespel, Peek, Teflon impregnated anodized AI, Alumina, Stainless Steel |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC(EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204-1:1997 EN 55011 EN ISO 12100-2:2003 RIA R15.06:1999 |
| Reliability per SEMI E10 | >15M MCBF |
