- Ultra-precise transport of flat panel displays (FPD)
- GPR ™ Technology
- Yaw axis
- Heavy payload ready
Designed for ultra-precise transport of large FPDs and 300mm wafers, the GPR-GB8Y robot system combines increased reach and load capacity while employing Nidec Genmark’s breakthrough patented GPR™ technology.
The GPR™ technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end effector deflection compensation during transport of heavier payloads.
The GPR-GB8Y robot system is an exceptionally robust, structurally reinforced transport system capable of handling heavy payloads including fixture end effectors for up to 300mmm wafer handling and large specialized end effectors for FPD transport applications.
- Modular design, decoupled mechanics, simple control and programming
- Smallest footprint for reach provides most efficient usage of available space around the robot system
- Advanced motion planning and axes coordination
- In-line and radial cassette / process chamber access capabilities
- Deflection compensation and compliant interaction with misaligned cassettes
- Optional dual Yaw axis (GB8Y)
| Configuration | GB8 (No Yaw) | GB8Y |
|---|---|---|
| Substrate Size | FPD, up to 300mm wafer | FPD, up to 300mm wafer |
| Arm Configurations | 2 Link 8"-8" 3 Link 4.425"-8.85"-4.425" 3 Link 5.95"-11.9"-5.95" 3 Link 8.05"-16.1"-8.05" | 2 Link 9.25"-9.25" 3 Link 4.425"-8.85"-4.425" 3 Link 5.95"-11.9"-5.95" 3 Link 8.05"-16.1"-8.05" 3 Link 9.25"-18.5"-9.25" |
| End Effector | Vacuum, Edge-Gripping, Gravity | Vacuum, Edge-Gripping, Gravity |
| Wafer Mapping | Reflective, retro reflective, through-beam, laser scanner | Reflective, retro reflective, through-beam, laser scanner |
| Physical Properties | ||
| Size (body diameter) | 14" | 14" |
| Vertical Stroke / Body Height | 12.5" / 21.5" 17.0" / 25.5" 20.0" / 27.5" 25.0" / 33.0" | 12.5" / 21.5" 17.0" / 25.5" 20.0" / 27.5" 25.0" / 33.0" |
| Axes | 5: T, R, Z, Z1, Z2 | 6: T, R, Y, Z, Z1, Z2 |
| Range of Motion | T: 500°
R: - 8"-8": [-15.2", 15.2"] - 4.425"-8.85"-4.425": [-16.8", 16.8"] - 5.95"-11.9"-5.95": [-22.6", 22.6"] - 8.05"-16.1"-8.05": [-30.7", 30.7"] Z: 12.5", 17", 20" Tilt: 1.5° | T: 500°
R: - 9"-9": [-17.6", 17.6"] - 4.425"-8.85"-4.425": [-16.8", 16.8"] - 5.95"-11.9"-5.95": [-22.6", 22.6"] - 8.05"-16.1"-8.05": [-30.7", 30.7"] - 9.25"-18.5"-9.25": [-35.15", 35.15"] Z: 12.5", 17", 20" Y: 344° Tilt: 1.5° |
| Performance | ||
| Payload (Dynamic/Static) | 5 lbs | 5 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" Y: +/- 0.005° |
| Environment | ||
| Cleanliness | ISO Class 1 Compatible | ISO Class 1 Compatible |
| Wafer Contact Material | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel |
| Standards compliance | ||
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/ EEC89/336/EEC (EMC) SEMI S2-93A | Machine Directive 89/392/EEC Low Voltage Directive 73/23/ EEC89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204-1:1997 EN 55011 EN ISO 12100-2:2003 RIA R15.06:1999 | EN 60204-1:1997 EN 55011 EN ISO 12100-2:2003 RIA R15.06:1999 |
| Reliability per SEMI E10 | >15M MCBF | >15M MCBF |
