- Superior motion performance
- Low particle generation and higher yields
- Increased reliability due to fewer moving parts
- Optimal throughput and repeatability
- Modular design reduces service cycle times
- Simplified maintenance and service
Nidec Genmark’s newest robotic series, the G-Rex3™ addresses all current technical specifications for standard payload 300mm wafer transport tool applications as the most precise and highest throughput atmospheric robot solution currently available on the market.
The G-Rex3™ robotic system offers a small footprint, optimal throughput, reliability and serviceability in a cost-effective package. It features innovative patent-pending designs, advanced control approaches and EZTeach technologies resulting in improved performance and reliability. The G-Rex3™ is a simplified low-mass product with fewer parts and moving components. The result is improved dynamics leading to higher acceleration and speed.
The G-Rex3™ is easy to install, teach, program and troubleshoot. Due to its versatility the robot supports diverse tool applications and flexible customizable configurations, including single arm, single end effectors, and vacuum or edge hold support.
- Low body weight for higher acceleration and yields
- Extended reach and vertical travel combination
- Extended rotation motion range
- DSP-based motion controller for vibration-free wafer transport
- Advanced motion planning and blending
- Optimal PID timing and gains scheduling
- Optional fast scanning feature
| Configuration | |
|---|---|
| Substrate Size | up to 300mm |
| Arm Configurations | 2 Link: 5.25"-5.25" 2 Link: 7.25"-7.25" 3 Link: 4"-8"-4" |
| End Effector | Vacuum, Edge-Gripping, Gravity, Bernoulli |
| Wafer Mapping | Reflective, through-beam, retro reflective, laser scanner |
| Physical Properties | |
| Size (body diameter) | 9.8" |
| Vertical Stroke / Body Height | 7" / 13.6" 12" / 18.6" 17" / 23.6" 20" / 26.6" |
| Axes | 3: T, R, Z |
| Range of Motion | T: 500° R: - 5.25"-5.25": [-10.5", 10.5"] - 7.25"-7.25": [-14.5", 14.5"] - 4"-8"-4": [-16", 16"] Z: 7"; 12"; 17"; 20" |
| Performance | |
| Payload | 2 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" |
| Environment | |
| Cleanliness | ISO Class 1 Compatible |
| Wafer Contact Material | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel |
| Standards compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC 89/336/EEC (EMC) SEMI S2-93A SEMI S8-95 |
| Standards to Verify Compliance | EN 55011 EN 50082-1 EN 60204-1 |
| Reliability per SEMI E10 | >15M MCBF |
