- An autonomous device for substrate alignment without robot participation
- Active edge contact wafer gripping mechanism
- Wafer buffer for increased throughput
The Edge Grip Prealigner is an autonomous device providing accurate and efficient wafer alignment and exceptional performance when combined with Nidec Genmark’s Edge Grip End Effectors. The Edge Grip Prealigner is designed to work with 300mm and 200mm notched wafers regardless of their coating characteristics.
A specially designed motion sequence delivers vibration and stress free performance throughout the entire alignment process. The optional wafer buffer increases the throughput in both single and batch wafers transfer modes.
- Non-contact notch detection
- High accuracy, performance and reliability
- Cost-effective, seamless integration with Genmark Robots equipped with Edge-gripping end effectors
| Configuration | |
|---|---|
| Substrate Size | 200mm, 300mm |
| Flat of notch orientation | Notch |
| Alignment Accuracy | |
| Center Offset | 0.004" (defined by the standard tolerances in the wafer size) |
| Angular Offset | +/- 0.01 degrees |
| Alignment time | Typical : 6 sec Min : 4 sec |
| Initial Offset Allowance | 0.04" |
| Servo Lighthouse Gap | 0.75" |
| Physical Properties | |
| Vertical travel-body height | No vertical travel |
| Length | 12" |
| Width | 10" |
| Height | 11" |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204- 1:1997 EN ISO 12100- 2:2003 RIA R15.06:1999 |
| Reliability | |
| Reliability per SEMI E10 / MCBF | >10M |
| Configuration | G-Rex 3 v.1 | G-Rex 3 v.2 |
|---|---|---|
| Substrate Size | up to 450mm | up to 450mm |
| Arm Configurations | 2 Link: 5.25"-5.25; 2 Link: 7-25"-7.25"; 3 Link: 4"-8"-4" | 5.205"-5.205" |
| End Effector | Vacuum, Edge-Gripping, Gravity | Vacuum, Edge-Gripping, Gravity |
| Wafer Mapping | Reflective; through-beam | Through-beam at the back side of the EE |
| Physical Properties | ||
| Size (Diameter/Length) | 9.76" (body DIA) and 30.25" | 9.8"/20.94" |
| Vert. stroke - body height | 7" - 13.6" 12" - 18.6" 17" - 23.6" 20" - 26.6" | NA (Grey) |
| Axes | 3 - T, R, Z | 3 - T, R, Z |
| Range of Motion | T: 500° R: - 5.25'-5.25': [-10.41 - 10.41] - 7.25'-7.25': [-14.5", 14.5"] - 4"-8"-4": [-16", 16"] Z: 7"; 12"; 17"; 20" | T: 500° R: [-10.41 - 10.41] Z: [10.7"] |
| Performance | ||
| Payload (Dynamic/Static) | 2 lbs | 2 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" |
| Environment | ||
| Cleanliness | ISO Class 1 Compatible | ISO Class 1 Compatible |
| Wafer Contact Material | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel |
| Standards compliance | ||
| Applicable Directives/Standards | Machine Directive 89/392/EEC 89/336/EEC (EMC) S2-93A S8-95 | Machine Directive 89/392/EEC 89/336/EEC (EMC) S2-93A S8-95 |
| Standards to Verify Compliance | EN 55011 EN 50082-1 EN 60204-1 | EN 55011 EN 50082-1 EN 60204-1 |
| Reliability per SEMI E10 | >15M MCBF | >15M MCBF |
