- High accuracy, performance and reliability
- Cost-effective, seamless integration with Nidec Genmark robots
- Can be configured for multiple vertical travel ranges


The Remote Prealigner (RPA) is an intelligent robot add-on, providing accurate and non-contact measurement of the eccentricity and the orientation of substrate placement. It is designed to be seamlessly integrated with Gencobot series 4, 7, 8, and GPR-SM robots, when substrate alignment is required by the material handling application.
The device can be arbitrarily placed inside the robot’s working envelope. It can be configured with several vertical travel ranges or without any vertical motion at all. The substrate can be placed on a chuck or on optional prealigner resting pins, depending on the shape of the robot’s end effector.
The operation of the prealigner includes a measurement of the wafer displacement, calculation of the necessary compensation, and orientation of the notch (or flat) to the desired angle. After the orientation is completed, the robot picks up the wafer with the necessary offset compensation. In order to maximize system throughput, the controller allows simultaneous operation of the prealigner and the robot – while the wafer is being measured, the robot can perform other tasks.
The RPA is designed for use in a wide range of applications regardless of the size, shape, transparency and thickness of the substrates to be aligned. The custom designed lighthouse provides accurate and reliable measurement of both solid and transparent objects. The built-in optics allow for substrate thickness as much as 6mm. The prealigner can measure wafers with diameters ranging from 50 to 300mm and square substrates from 75 to 200mm. An optional moving lighthouse provides software-controlled adjustment to the different substrate sizes.
- Versatility - measures all substrate sizes and shapes, both solid and transparent, without adjustment
- Numerous options for simple integration - vertical travel, moving lighthouse, resting pins
| Configuration | |
|---|---|
| Substrate Type | Wafer, reticle |
| Substrate Size | 2”, 3”, 4”, 5”, 6”, 8”, 12” |
| Flat or notch orientation | Flat, notch |
| Alignment Accuracy | |
| Center Offset | 0.002" |
| Angular Offset | 0.1 degrees |
| Alignment time | 5 sec. |
| Initial Offset Allowance | 0.5" |
| Servo Lighthouse Gap | 0.35", 0.5", 1.2" |
| Maximum Vertical Velocity | 20"/s |
| Maximum Vertical Acceleration | 40"/s2 |
| Physical Properties | |
| Vertical travel-body height | 8.5" - 14" 13"- 18.5 16" – 25.35 |
| Length | 12.3" |
| Width | 3.4" |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204- 1:1997 EN ISO 12100- 2:2003 RIA R15.06:1999 |
| Reliability | |
| Reliability per SEMI E10 / MCBF | >20M |
| Configuration | G-Rex 3 v.1 | G-Rex 3 v.2 |
|---|---|---|
| Substrate Size | up to 450mm | up to 450mm |
| Arm Configurations | 2 Link: 5.25"-5.25; 2 Link: 7-25"-7.25"; 3 Link: 4"-8"-4" | 5.205"-5.205" |
| End Effector | Vacuum, Edge-Gripping, Gravity | Vacuum, Edge-Gripping, Gravity |
| Wafer Mapping | Reflective; through-beam | Through-beam at the back side of the EE |
| Physical Properties | ||
| Size (Diameter/Length) | 9.76" (body DIA) and 30.25" | 9.8"/20.94" |
| Vert. stroke - body height | 7" - 13.6" 12" - 18.6" 17" - 23.6" 20" - 26.6" | NA (Grey) |
| Axes | 3 - T, R, Z | 3 - T, R, Z |
| Range of Motion | T: 500° R: - 5.25'-5.25': [-10.41 - 10.41] - 7.25'-7.25': [-14.5", 14.5"] - 4"-8"-4": [-16", 16"] Z: 7"; 12"; 17"; 20" | T: 500° R: [-10.41 - 10.41] Z: [10.7"] |
| Performance | ||
| Payload (Dynamic/Static) | 2 lbs | 2 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" |
| Environment | ||
| Cleanliness | ISO Class 1 Compatible | ISO Class 1 Compatible |
| Wafer Contact Material | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel |
| Standards compliance | ||
| Applicable Directives/Standards | Machine Directive 89/392/EEC 89/336/EEC (EMC) S2-93A S8-95 | Machine Directive 89/392/EEC 89/336/EEC (EMC) S2-93A S8-95 |
| Standards to Verify Compliance | EN 55011 EN 50082-1 EN 60204-1 | EN 55011 EN 50082-1 EN 60204-1 |
| Reliability per SEMI E10 | >15M MCBF | >15M MCBF |



