• High accuracy, performance and reliability
  • Cost-effective, seamless integration with Nidec Genmark robots
  • Can be configured for multiple vertical travel ranges

The Remote Prealigner (RPA) is an intelligent robot add-on, providing accurate and non-contact measurement of the eccentricity and the orientation of substrate placement. It is designed to be seamlessly integrated with Gencobot series 4, 7, 8, and GPR-SM robots, when substrate alignment is required by the material handling application.

The device can be arbitrarily placed inside the robot’s working envelope. It can be configured with several vertical travel ranges or without any vertical motion at all. The substrate can be placed on a chuck or on optional prealigner resting pins, depending on the shape of the robot’s end effector.

The operation of the prealigner includes a measurement of the wafer displacement, calculation of the necessary compensation, and orientation of the notch (or flat) to the desired angle. After the orientation is completed, the robot picks up the wafer with the necessary offset compensation. In order to maximize system throughput, the controller allows simultaneous operation of the prealigner and the robot – while the wafer is being measured, the robot can perform other tasks.

The RPA is designed for use in a wide range of applications regardless of the size, shape, transparency and thickness of the substrates to be aligned. The custom designed lighthouse provides accurate and reliable measurement of both solid and transparent objects. The built-in optics allow for substrate thickness as much as 6mm. The prealigner can measure wafers with diameters ranging from 50 to 300mm and square substrates from 75 to 200mm. An optional moving lighthouse provides software-controlled adjustment to the different substrate sizes.

  • Versatility - measures all substrate sizes and shapes, both solid and transparent, without adjustment
  • Numerous options for simple integration - vertical travel, moving lighthouse, resting pins
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Configuration
Substrate TypeWafer, reticle
Substrate Size2”, 3”, 4”, 5”, 6”, 8”, 12”
 Flat or notch orientationFlat, notch
Alignment Accuracy
 Center Offset0.002"
 Angular Offset0.1 degrees
 Alignment time 5 sec.
 Initial Offset Allowance 0.5"
 Servo Lighthouse Gap 0.35", 0.5", 1.2"
 Maximum Vertical Velocity 20"/s
 Maximum Vertical Acceleration40"/s2
Physical Properties
 Vertical travel-body height8.5" - 14"
13"- 18.5
16" – 25.35
Length12.3"
Width3.4"
Standards Compliance
Applicable Directives/StandardsMachine Directive 89/392/EEC

Low Voltage Directive 73/23/EEC
89/336/EEC (EMC)
SEMI S2-93A
Standards to Verify ComplianceEN 60204- 1:1997

EN ISO 12100- 2:2003
RIA R15.06:1999
Reliability
Reliability per SEMI E10 / MCBF>20M
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ConfigurationG-Rex 3 v.1G-Rex 3 v.2
Substrate Sizeup to 450mmup to 450mm
Arm Configurations2 Link: 5.25"-5.25;
2 Link: 7-25"-7.25";
3 Link: 4"-8"-4" 
5.205"-5.205"
End EffectorVacuum, Edge-Gripping, GravityVacuum, Edge-Gripping, Gravity
Wafer MappingReflective; through-beamThrough-beam at the back side of the EE

Physical Properties


Size (Diameter/Length) 9.76" (body DIA) and 30.25"
9.8"/20.94"

Vert. stroke - body height7" - 13.6"
12" - 18.6"
17" - 23.6"
20" - 26.6"
NA (Grey)
Axes3 - T, R, Z
3 - T, R, Z
Range of MotionT: 500°
R: - 5.25'-5.25': [-10.41 - 10.41]
- 7.25'-7.25':  [-14.5", 14.5"]
- 4"-8"-4": [-16", 16"]
Z: 7"; 12"; 17"; 20"
T: 500°
R: [-10.41 - 10.41]
Z: [10.7"]
Performance


Payload (Dynamic/Static)2 lbs
2 lbs
RepeatabilityT: +/- 0.01°
R: +/- 0.001"
Z: +/- 0/001" 

T: +/- 0.01°
R: +/- 0.001"
Z: +/- 0/001" 
Environment
Cleanliness ISO Class 1 Compatible

 ISO Class 1 Compatible
Wafer Contact MaterialVespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel

Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel
Standards compliance
Applicable Directives/StandardsMachine Directive 89/392/EEC
89/336/EEC (EMC)
S2-93A
S8-95

Machine Directive 89/392/EEC
89/336/EEC (EMC)
S2-93A
S8-95
Standards to Verify ComplianceEN 55011
EN 50082-1
EN 60204-1

EN 55011
EN 50082-1
EN 60204-1
Reliability per SEMI E10 >15M MCBF

 >15M MCBF
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