- Performance and reliability in a standalone, autonomous device
- Cost-effective, seamless integration with Nidec Genmark robots
- High-resolution, high-accuracy chuck movement guarantees maximally precise alignment for a wide range of substrate displacement.


Nidec Genmark’s standalone prealigner is an autonomous device, which provides accurate, non-contact measurement of the eccentricity and orientation of substrate placement. It can be integrated with numerous substrate-manipulating devices when high alignment accuracy is required in the face of wide range initial substrate misplacement.
The substrate can be placed onto a chuck or onto optional resting pins of the pre aligner, depending on the shape of the robot’s end effector. The chuck is equipped with two servo-axes, X and Y, which enable it to move underneath the substrate (which at that time is resting on the pins) and compensate for any misalignment. The operations of the standalone prealigner include wafer displacement measurement, calculation of the necessary compensation, and orientation of the notch (or the flat) to the desired angle. The high-resolution and accuracy of the chuck-movement guarantees very precise alignment in wide range substrate displacement.
The standalone prealigner is designed for use in a wide range of applications regardless of the size, shape, transparency, and thickness of the substrates that are to be aligned. The custom-designed lighthouse provides accurate and reliable measurement of both solid and transparent objects. The built-in optics allow for substrate thickness as much as 6mm. The prealigner can measure wafers with diameters ranging from 75 to 300mm and square substrates from 75 to 200mm. An optional moving lighthouse provides software-controlled adjustment for different substrate sizes.
- Versatility - measures all substrate sizes and shapes, both solid and transparent, without adjustment
- Numerous options for simple integration - moving lighthouse, resting pins
- Optional moving lighthouse provides software-controlled adjustment for different substrate sizes.
| Configuration | |
|---|---|
| Substrate Type | Wafer, reticle |
| Substrate Size | 3”, 4”, 5”, 6” ,8”, 12” |
| Flat or notch orientation | Flat, notch |
| Alignment Accuracy | |
| Center Offset | 0.0005" |
| Angular Offset | 0.05° |
| Alignment Time | 300mm wafers : 4 sec 200mm wafers : 3.5 sec |
| Initial Offset Allowance | 0.5" |
| Servo Lighthouse Gap | 0.35", 0.5", 1.2" |
| Physical Properties | |
| Length | 12" |
| Width | 10" |
| Height | 11" |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204- 1:1997 EN ISO 12100- 2:2003 RIA R15.06:1999 |
| Reliability | |
| Reliability per SEMI E10 / MCBF | >10M |
| Configuration | G-Rex 3 v.1 | G-Rex 3 v.2 |
|---|---|---|
| Substrate Size | up to 450mm | up to 450mm |
| Arm Configurations | 2 Link: 5.25"-5.25; 2 Link: 7-25"-7.25"; 3 Link: 4"-8"-4" | 5.205"-5.205" |
| End Effector | Vacuum, Edge-Gripping, Gravity | Vacuum, Edge-Gripping, Gravity |
| Wafer Mapping | Reflective; through-beam | Through-beam at the back side of the EE |
| Physical Properties | ||
| Size (Diameter/Length) | 9.76" (body DIA) and 30.25" | 9.8"/20.94" |
| Vert. stroke - body height | 7" - 13.6" 12" - 18.6" 17" - 23.6" 20" - 26.6" | NA (Grey) |
| Axes | 3 - T, R, Z | 3 - T, R, Z |
| Range of Motion | T: 500° R: - 5.25'-5.25': [-10.41 - 10.41] - 7.25'-7.25': [-14.5", 14.5"] - 4"-8"-4": [-16", 16"] Z: 7"; 12"; 17"; 20" | T: 500° R: [-10.41 - 10.41] Z: [10.7"] |
| Performance | ||
| Payload (Dynamic/Static) | 2 lbs | 2 lbs |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" | T: +/- 0.01° R: +/- 0.001" Z: +/- 0/001" |
| Environment | ||
| Cleanliness | ISO Class 1 Compatible | ISO Class 1 Compatible |
| Wafer Contact Material | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel | Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel |
| Standards compliance | ||
| Applicable Directives/Standards | Machine Directive 89/392/EEC 89/336/EEC (EMC) S2-93A S8-95 | Machine Directive 89/392/EEC 89/336/EEC (EMC) S2-93A S8-95 |
| Standards to Verify Compliance | EN 55011 EN 50082-1 EN 60204-1 | EN 55011 EN 50082-1 EN 60204-1 |
| Reliability per SEMI E10 | >15M MCBF | >15M MCBF |



