• Performance and reliability in a standalone, autonomous device
  • Cost-effective, seamless integration with Nidec Genmark robots
  • High-resolution, high-accuracy chuck movement guarantees maximally precise alignment for a wide range of substrate displacement.

Nidec Genmark’s standalone prealigner is an autonomous device, which provides accurate, non-contact measurement of the eccentricity and orientation of substrate placement. It can be integrated with numerous substrate-manipulating devices when high alignment accuracy is required in the face of wide range initial substrate misplacement.

The substrate can be placed onto a chuck or onto optional resting pins of the pre aligner, depending on the shape of the robot’s end effector. The chuck is equipped with two servo-axes, X and Y, which enable it to move underneath the substrate (which at that time is resting on the pins) and compensate for any misalignment. The operations of the standalone prealigner include wafer displacement measurement, calculation of the necessary compensation, and orientation of the notch (or the flat) to the desired angle. The high-resolution and accuracy of the chuck-movement guarantees very precise alignment in wide range substrate displacement.

The standalone prealigner is designed for use in a wide range of applications regardless of the size, shape, transparency, and thickness of the substrates that are to be aligned. The custom-designed lighthouse provides accurate and reliable measurement of both solid and transparent objects. The built-in optics allow for substrate thickness as much as 6mm. The prealigner can measure wafers with diameters ranging from 75 to 300mm and square substrates from 75 to 200mm. An optional moving lighthouse provides software-controlled adjustment for different substrate sizes.

  • Versatility - measures all substrate sizes and shapes, both solid and transparent, without adjustment
  • Numerous options for simple integration - moving lighthouse, resting pins
  • Optional moving lighthouse provides software-controlled adjustment for different substrate sizes.
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Configuration
Substrate TypeWafer, reticle
Substrate Size3”, 4”, 5”, 6” ,8”, 12”
 Flat or notch orientationFlat, notch
Alignment Accuracy
 Center Offset0.0005"
 Angular Offset0.05°
 Alignment Time300mm wafers : 4 sec 
200mm wafers : 3.5 sec
 Initial Offset Allowance 0.5"
 Servo Lighthouse Gap 0.35", 0.5", 1.2"
Physical Properties
Length12"
Width10"
Height11"
Standards Compliance
Applicable Directives/StandardsMachine Directive 89/392/EEC

Low Voltage Directive 73/23/EEC
89/336/EEC (EMC)
SEMI S2-93A
Standards to Verify ComplianceEN 60204- 1:1997

EN ISO 12100- 2:2003
RIA R15.06:1999
Reliability
 Reliability per SEMI E10 / MCBF>10M
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ConfigurationG-Rex 3 v.1G-Rex 3 v.2
Substrate Sizeup to 450mmup to 450mm
Arm Configurations2 Link: 5.25"-5.25;
2 Link: 7-25"-7.25";
3 Link: 4"-8"-4" 
5.205"-5.205"
End EffectorVacuum, Edge-Gripping, GravityVacuum, Edge-Gripping, Gravity
Wafer MappingReflective; through-beamThrough-beam at the back side of the EE

Physical Properties


Size (Diameter/Length) 9.76" (body DIA) and 30.25"
9.8"/20.94"

Vert. stroke - body height7" - 13.6"
12" - 18.6"
17" - 23.6"
20" - 26.6"
NA (Grey)
Axes3 - T, R, Z
3 - T, R, Z
Range of MotionT: 500°
R: - 5.25'-5.25': [-10.41 - 10.41]
- 7.25'-7.25':  [-14.5", 14.5"]
- 4"-8"-4": [-16", 16"]
Z: 7"; 12"; 17"; 20"
T: 500°
R: [-10.41 - 10.41]
Z: [10.7"]
Performance


Payload (Dynamic/Static)2 lbs
2 lbs
RepeatabilityT: +/- 0.01°
R: +/- 0.001"
Z: +/- 0/001" 

T: +/- 0.01°
R: +/- 0.001"
Z: +/- 0/001" 
Environment
Cleanliness ISO Class 1 Compatible

 ISO Class 1 Compatible
Wafer Contact MaterialVespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel

Vespel, Peek, Teflon impregnated anodized Al, Alumina, Stainless Steel
Standards compliance
Applicable Directives/StandardsMachine Directive 89/392/EEC
89/336/EEC (EMC)
S2-93A
S8-95

Machine Directive 89/392/EEC
89/336/EEC (EMC)
S2-93A
S8-95
Standards to Verify ComplianceEN 55011
EN 50082-1
EN 60204-1

EN 55011
EN 50082-1
EN 60204-1
Reliability per SEMI E10 >15M MCBF

 >15M MCBF
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