- GPR ™ technology
- Vertical travel up to 9.0” eliminates the need for indexers and elevators
- Ultra-heavy payload (up to 33lbs with heavy-duty arms), FPD transport ready
- Ultra high vacuum compatible (up to 10E-10 Torr)
The GPR-GB9 Vacuum Robot System is one of the latest additions to Nidec Genmark’s GPR™ line of precision transport robotics and is available with vertical stroke options of 3″, 6″ and 9″.
The GPR-GB9 provides accurate, repeatable indexing and transportation of semiconductor wafers in vacuum processing capital equipment down to 10-10 Torr. This robot features Nidec Genmark Automation’s breakthrough GPR™ System to achieve the highest level of performance currently available in a 300mm compatible vacuum wafer/FPD handler.
The patented GPR technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end effector deflection compensation during transport of heavier payloads.
- High payload, ideal choice for large FPD and wafer platen applications
- Alignment free
- Less than class 1 clean room compatible
- Mountable from top or bottom of mounting plate
- Deflection compensation
| Configuration | |
|---|---|
| Cleanliness | < Class 1 Clean Room Compatible |
| Substrate Size | Wafers up to 300mm FPDs, platters and other fixtures |
| Arm Configurations | 2 Link 7.5"-7.5" 2 Link 10.5"-10.5" 2 Link 12.5"-12.5" 2 Link 15"-15" |
| End Effector | Gravity |
| Physical Properties | |
| Size (body diameter) | 14" |
| Vertical Stroke / Body Height: | 3" / 26.2" 6" / 29.2" 9" / 32.2" |
| Axes | 3: T, R, Z. |
| Range of Motion | T: 500° R: - 7.5"-7.5": +/- 14.5" - 10.5"-10.5": +/- 20" - 12.5"-12.5": +/- 24" R (heavy duty arm): - 12.5"-12.5": +/- 24" Z: 3", 6", 9" Tilt: 1.0° |
| Performance | |
| Payload | 25lbs (standard arms) 33lbs (heavy duty arms) |
| Base Operating Pressure | 10E-10 Torr |
| Leak Rate | <1*10E-9 std cc/sec |
| Repeatability | T: +/- 0.01° R: +/- 0.001" Z: +/- 0.001" |
| Radial ( R ) | 0.001" |
| Rotational ( T ) | 0.01° |
| Vertical ( Z ) | 0.001" |
| Reliability (MTBF) | >80,000 hours |
| Environment | |
| Wafer Contact Materials | Aluminum, SS, Viton |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204-1:1997 EN ISO 12100-2:2003 RIA R15.06:1999 |
| Reliability per SEMI E10 | >14M MCBF |
