- GPR ™ technology
- Advanced motion planning and axes coordination
- Heavy payload, FPD transport ready
- Ultra high vacuum compatible (up to 10E-10 Torr)
The GPR-SMV Vacuum Robot System is a high-performance dual-arm vacuum robot employing Nidec Genmark’s breakthrough patented GPR™ technology.
The GPR-SMV Vacuum Robot System combines the functionality of a two link robotic arm for accurate, repeatable indexing and transportation of semiconductor wafers in vacuum down to 10E-10 Torr, with the motion of dual arms performing wafer swapping at the process chambers, source cassettes etc.
The mechanics of this robot contribute to its simplicity, modular design, easy control, teaching, and programming. Advanced motion planning in continuous smooth trajectories guarantees superior performance and effective implementation in various back-end layouts.
The patented GPR technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end effector deflection compensation during transport of heavier payloads.
- High payload, ideal choice for large FPD and wafer platen applications
- Smallest footprint for its reach, provides the most efficient usage of the available space around the robotic system
- Less than class 1 clean room compatible
- Radial cassettes / process chambers access capabilities
- Deflection compensation and compliant interaction with misaligned cassettes
| Configuration | |
|---|---|
| Substrate Size | Wafers up to 300mm |
| Arm Configurations | 2 Link 6.5"-6.5" |
| End Effector | Gravity |
| Physical Properties | |
| Size (body diameter) | 14" |
| Body Height | 24.1" |
| Axes | 6: T, R, R2, Z, Z1, Z2 |
| Range of Motion | T: 360° R and R2: - 6.5"-6.5": [- 12.8", 12.8"] Z: 3" Tilt: 1.0° |
| Performance | |
| Payload | 12lbs |
| Base Operating Pressure | 10E-10 Torr |
| Leak Rate | <1*10E-9 std cc/sec |
| Repeatability | T: +/- 0.01° R: +/- 0.001" R2: +/- 0.001" Z: +/- 0.001" |
| Radial ( R ) | 0.001" |
| Rotational ( T ) | 0.01° |
| Vertical ( Z ) | 0.001" |
| Reliability (MTBF) | >80,000 hours |
| Environment | |
| Cleanliness | < Class 1 Clean Room Compatible |
| Wafer Contact Materials | Aluminum, SS, Viton, Vacuum Grease |
| Standards Compliance | |
| Applicable Directives/Standards | Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance | EN 60204-1:1997 EN ISO 12100-2:2003 RIA R15.06:1999 |
| Reliability per SEMI E10 | >14M MCBF |
